What is Magnetron Sputtering Coating
Physical vapor deposition (PVD) describes a variety of vacuum deposition methods which can be used to produce thin films and coatings. PVD is characterized by a process in which the material goes from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.
Thus, PVD by Sputtering is a term used to refer to a physical vapor deposition (PVD) technique wherein atoms or molecules are ejected from a target material by high-energy particle bombardment so that the ejected atoms or molecules can condense on a substrate as a thin film.
Magnetron Sputtering Coating Process
- Use Large area targets which gives uniform thickness over the wafer
- Control the thickness by deposition time and other parameters
- Even materials with very high melting points are easily sputtered
- Sputtered film typically have a better adhesion on the substrate
- Sputtering can be performed top-down
- Ions are generated and directed at a target
- The ions sputter targets atoms
- The ejected atoms are transported to the substrate
- Atoms condense and form a thin film
Applications
